Mechanical Testing
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Dynamic Universal Testing Machine (UTM): Instron 25kN
- To evaluate the endurance capacity of the material/ product under continuous/ repeated (fatigue) loading upto few million cycles.
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Static and Dynamic Testing of Implants and Materials
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Double-acting servo-hydraulic actuator with force capacity up to ±25 kN and torque capacity of ±250 Nm
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100 mm of usable axial stroke and ±50° of rotation
Dynamic Universal Testing Machine (UTM): Instron 10kN
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Static and Dynamic Testing of Implants and Materials
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Servo Electric Axial UTM with force capacity up to ±10 kN
Universal Testing Machine: Instron 5kN
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Static and Dynamic Testing of Implants and Materials
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Axial Static Testing UTM with force capacity up to ±5 kN
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Max. Speed: 50 mm/min
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Min. Speed: 0.001 mm/min
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Position Control Resolution: 9.5 nm
Universal Testing Machine: Zwick Roell LTM 10 electro-dynamic testing machine
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Test load Dynamic: ± 10 kN
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Test load Static: ± 7 kN
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Maximum frequency: 100 Hz
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Piston stroke: 60 mm
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Speed range: 1.5 mm/min
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Positioning accuracy and repeatability: ± 2 μm
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Torsion: ± 100 Nm (Dynamic)
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Torsion: ± 70 Nm (Static)
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Rotations ± 500 RPM
Hardness Testing: FALCON 500G2
Automatic Hardness Tester
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Scales: Micro Vickers, Vickers, Knoop, Brinell
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Test Forces: 0.1gf – 62.5kgf (multi load cell, closed loop)
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Camera : 11 Megapixel, Full HD+, integrated TTL camera system
Objectives: 2.5X, 5X, 10X, 20X, 50X, 100X
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6 Position Turret: 2 indenter positions, 4 objective positions
Profilometer: Rtec UP-2000
- To measure and quantify the surface roughness in microns
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White Light Interferometry
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Phase-Shift Interference
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Variable Focus Imaging
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Automatic Stitching
Micro-Computed Tomography (CT) Bruker SKYSCAN 1273
- For non-destructive evaluation of materials (metals, tissues and ceramics) using X-rays
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Object size: 250 mm diameter, 250 mm height
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X-ray source: 40-130 kV, 39 W
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X-ray detector: Active pixel CMOS flat-panel, 6 MP (3072 x 1944)
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Fast scans for QC, or 4D XRM
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Voxel size < 3 µm
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3D spatial resolution < 5 µm
Optical Tensiometer Theta Flex
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Accuracy (°, mN/m) ±0.1, ±0.01
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Measurement: Contact Angle (Sessile, Batch, Dynamic, Pendant, Meniscus), Surface Tension, Surface Free Energy, 3D surface roughness and roughness-corrected contact angle
Field Emission Scanning Electron Microscope (FESEM) with EDS(Energy Dispersive X-ray Spectroscopy) and EBSD (Electron Backscatter Diffraction)
Thermo Fisher Scientific FESEM integrated with EDS and EBSD facilities for advanced microstructural, elemental, and crystallographic analysis.
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Resolution: up to 0.6 nm
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Magnification range: 25X to 2,000,000X
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Accelerating voltage: 20 V to 30 kV
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Probe Current: 3pA to 400nA
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EDS for elemental composition and mapping
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EBSD for grain orientation, texture, and phase analysis
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Suitable for metals, ceramics, polymers, thin films, powders, and nanomaterials
Universal Testing Machine: Instron 200N
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Static and Dynamic Testing of Materials
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Single column UTM with maximum force rating of ± 200 N load application
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Total actuator stroke: 50 mm
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Resolution: 0.001 N