Facilities for MedTech Product Development

Prototyping & Polymeric Additive Manufacturing

Metal Additive Manufacturing

Biofabrication

Electronic circuit/ PCB fab.

3D Circuit Printing

Prototyping & Polymeric Additive Manufacturing
fab@mpragati.in

Fused Deposition Modelling

Printer: Bigrep Studio G2

Ideal for: Large scale printing

Build volume: 1000 x 500 × 500 mm

Materials: PLA, PETG, Pro HT, TPU, PA6/66

Nozzle size: 0.6 mm

Extruder: Dual extruder

Layer height: 100 – 500 microns

Printer: Ultimaker S5 Pro Bundle

Ideal for: Small scale printing

Build volume: 330 x 240 x 300 mm

Materials: PLA, ABS, CPE, PC, PP, Nylon, TPU

Nozzle size: 0.25, 0.40, 0.60, 0.80 mm

Extruder: Dual extruder

Layer height: 150 – 600 microns

Digital Light Processing (DLP) & Stereolithography (SLA)

Printer: Formlabs 3BL

Ideal for: Large scale printing

Build volume: 335 × 200 × 300 mm

Materials: Application specific resins

Layer height: 25 – 300 microns

Printer: 3D Systems Figure 4

Ideal for: High quality, fast printing

Build volume: 125 x 70 x 196 mm

Materials: Application specific resins

Layer height: 10 -100 microns

Material Jetting (Polyjet)

Printer: Stratasys OBJET30 PRIME

Ideal for: Biocompatible printing (upto 24 hours)

Build volume: 300 x 200 x 100 mm

Material: Med620

Layer height: 36 Microns

Metal Additive Manufacturing

Laser Powder Bed Fusion (LPBF)
fab@mpragati.in

Printer: 3D System DMP Flex 350

Ideal for: Metal 3D printing

Build volume: 275x 275x 420 mm

Material: Dedicated medical grade Ti6Al4V G23

Layer height: 30 Microns or more

(To be operational by September 2023)

Biofabrication

Bioprinter (Live Cell Printing)

Printer: Advance Solutions Bioassemblybot 500

Ideal for: Cell 3D printing

Dimension: 165.4x 84.4x 192.2 cm

Material: Multiple

6 axis Robotic arm

Class II, Type-A biosafety cabinet

(To be operational by November, 2023)

Electronic Circuit and PCB Fabrication
pcb@mpragati.in

PCB Fabrication Process

PCB Assembly Process

PCB Fabrication

ProMat S104

Functionality

Structuring
Drilling
Cutting
Finishing

MultiPress S4

Functionality

Lamination

Contac S4

Functionality

Through Hole plating

ProtoMask+ProLegend

Functionality

Finishing

Specification

Max Layers: 8 Nos.

Max Board Size: 229x300 mm

Min track width: 0.1 mm

Min through hole: 0.2 mm

Max board thickness: 4 mm

PCB Assembly

FRITSCH PlaceALL 520

Functionality

Solder-paste dispensing
Component placement

EPS RF 300

Functionality

Reflow soldering

Specification

Placement rate: 4000SMD Components per hour

Smallest component: 0201 (~ 0.6x 0.3 mm)

Placement accuracy: ± 0.1 mm

Work area: 520x 370 mm

3D Circuit Printer
pcb@mpragati.in

Printer: IDS NanoJet Desktop

Ideal for: 3D Circuit printing

Build Volume: 300x200x100 mm

Material: Au, Ag, Cu, Al, Pt

Min. Conductive Layer thickness: 100 nm to 15 μm

(To be operational by August, 2023)

Facilities for MedTech Product Development

Prototyping & Polymeric Additive Manufacturing fab@mpragati.in

Fused Deposition Modelling

Digital Light Processing (DLP) & Stereolithography (SLA)

Material Jetting (Polyjet)

Metal Additive Manufacturing Laser Powder Bed Fusion (LPBF) fab@mpragati.in

Biofabrication Bioprinter (Live Cell Printing)

Electronic Circuit and PCB Fabrication pcb@mpragati.in

PCB Fabrication Process

PCB Assembly Process

PCB Fabrication

Specification

PCB Assembly

Specification

3D Circuit Printer pcb@mpragati.in

Prototyping & Polymeric Additive Manufacturing
fab@mpragati.in

Metal Additive Manufacturing

Laser Powder Bed Fusion (LPBF)
fab@mpragati.in

Biofabrication

Bioprinter (Live Cell Printing)

Electronic Circuit and PCB Fabrication
pcb@mpragati.in

3D Circuit Printer
pcb@mpragati.in