Digital Light Processing (DLP) & Stereolithography (SLA)
Material Jetting (Polyjet)
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Metal Additive Manufacturing
Laser Powder Bed Fusion (LPBF)
fab@mpragati.in
Ceramic Additive Manufacturing
Stereolithography
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Machining
EDM
fab@mpragati.in
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Biofabrication
Bioprinter (Live Cell Printing)
Mechanical Testing
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Electronic Circuit and PCB Fabrication
pcb@mpragati.in
PCB Fabrication Process
PCB Assembly Process
PCB Fabrication
ProMat S104
Functionality
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Structuring
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Drilling
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Cutting
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Finishing
MultiPress S4
Functionality
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Lamination
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Contac S4
Functionality
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Through Hole plating
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ProtoMask+ProLegend
Functionality
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Finishing
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Specification
Max Layers: 8 Nos.
Max Board Size: 229x300 mm
Min track width: 0.1 mm
Min through hole: 0.2 mm
Max board thickness: 4 mm
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PCB Assembly
FRITSCH PlaceALL 520
Functionality
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Solder-paste dispensing
- Component placement
EPS RF 300
Functionality
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Reflow soldering
Specifications
Placement rate: 4000SMD Components per hour
Smallest component: 0201 (~ 0.6x 0.3 mm)
Placement accuracy: ± 0.1 mm
Work area: 520x 370 mm
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3D Circuit Printer
pcb@mpragati.in
How to Engage with us?
Choose the type of Testing or Manufacturing or Product Development and email us at